YAC dry etcher agent sales, assembly and debugging, after-sales service
Sales of all parts of the equipment
Parts repair service (matching box, chiller, gate valve, vacuum robot, stage recoating, etc.)
On-site equipment repair service.
Equipment software/hardware upgrade
Chamber Type: Multi Chamber
Process Module: Max. 5Chambers
Glass Size: Minimum: 300mm × 400mm Maximum: 2200mm × 2500mm
Plasma Mode: ICP (Inductive Coupled Plasma) RIE (Reactive Ion Etching)
Substrate fixing: ESC (Electro-Static Chuck)
Cooling System: He gas pressure control
Y.A.C. Dry etching system for FPD production, using new developed plasma technology.
It is the most suitable equipment for efficiency of manufacturing process and increased productivity for highly precise processing of LTPS or OLED, TAOS, smartphones, TV, and monitor etc.
Also, this equipment is compatible for special use etching process, other than FPD.
Main application fields:
FPD, Optical device, MEMS, PCB, FOPLP, Photomask etc, Microfabrication for silicon based, and metal based thin layer，Resist and organic layer ashing，DISCOM , Plasma cleaning，Batch processing for small size substrate etc.
